Print fremstilling

Produktion af elektroniske print

Er det din udfordring at finde printkort og interconnect-løsninger af høj kvalitet til konkurrencedygtige priser, så er vi leveringsdygtige

Vores dedikerede team af erfarende PCB fagfolk giver dig innovative løsninger og omfattende design support som dækker dine unikke krav.

Vi dækker følgende service:

  • Levering af alle typer print
  • Production purchase order management
  • RFQ/sample/first article inspection
  • Design for manufacturing (DFM) review
  • Check plot review/approvals
  • Schedule changes/expedites
  • Freight/logistics coordination
  • Quality commitment

PCB Solutions

  • Flexible circuits
  • Rigid circuits
  • Rigid-flex circuits
  • Aluminum/metal clad
  • Copper and bondable PCBs
  • Ceramic PCBs
  • Teflon/metal PCBs
  • Thermal clad
  • Membrane circuits

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Capabilities

  • Rapid prototyping
  • Rigid boards from 1 to 36 layers
  • Flex circuits from 1 to 6 layers
  • Controlled impedance: +/-8%
  • Thin laminate capability down to 4 mil
  • HAL, lead-free HAL, Flash gold, ENIG, ENEPIG, gold finger plating, selective gold plating, Entek, immersion tin, immersion silver surface finishes
  • Silver ink through holes, silver and carbon ink jumper, carbon printing, peelable solder mask
  • Materials: CEM-1, CEM-3, FR-1, FR-2, FR-4, FR-5 (High Tg), High Tg Material (Tg = 180º C), BT, Rogers, Megtron, ISOLA, polyamide, and ceramic material
  • Finished board thickness: 0.25 mm/0.010 inch to 7.0 mm/0.275 in
  • Copper thickness up to 10 oz
  • Hole size: 0.1 mm/0.004 inch minimum (4 mil)
  • Trace size: 0.076 mm/0.003 inch minimum (3 mil)
  • Trace spacing: 0.076 mm/0.003 inch minimum (3 mil)
  • Aspect ratio: 12:1

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